Oerlikon Shuttlelock 700 series ICP RIE
An ICP RIE (Inductively Coupled Plasma Reactive Ion Etcher) is a tool used to selectively
etch dielectrics, polymers, and metals. Ions are accelerated towards a substrate where
both chemical and physical etching occur at the surface allowing high etch rates and
anisotropic profiles. This tool incorporates two separate power supplies, one to generate
the plasma and the other to control the ion acceleration towards the substrate. This
allows great flexibility and control in the creation of a custom process. This system
is also equipped with helium backside cooling of the substrate and active liquid nitrogen
cooling of the chuck.
Automatic Load Lock/Wafer Handling
Plasma Generation Supply – 2MHz, 1500W
Plasma Biasing Supply – 13.5MHz, 600W
Gases: CF4, CHF3, Ar, O2, SF6, H2, Cl2, and N2