AJA Orion Magnetron Sputterer
Sputtering occurs by accelerating ions towards an intended target material. The resulting
collision causes the target material to be expelled outwards where it collects onto
an intended substrate. This sputterer is equipped with 5 magnetron guns which support
2” diameter targets. There are RF, DC, and DC-pulsed power supplies which allow the
sputtering of both metals and dielectrics. Substrate biasing and rotation is available
as well as substrate heating which can be managed up to 850°C. Co-sputtering can be
accomplished by operating multiple guns simultaneously and reactive sputtering can
be performed by including nitrogen or oxygen into the plasma.
5 - 2" magnetron guns w/ 4" wafer load-lock (5” capable if no heating needed)
DC Source DCX5750 - 750W
DC Pulse - Pinnacle - 1000W
AC Source - AJA 100/300 RF - 300W
Bias Source (AC) - AJA 100/300 RF – 50W
Gases – Ar, N2, O2
Typical Targets – Cu, Cr, Au, Ti, Al, W